IEEE

Degradation Mechanisms of SiC MOSFET Power Module With Cu–Cu Die Top Interconnects Under Power Cycling Stress

Abstract: Because of the wide application of die top interconnects with Cu bonding wire, the weak points in SiC MOSFET power modules presented a huge difference compared to the conventional modules ...
IEEE

TensorCIM: Digital Computing-in-Memory Tensor Processor With Multichip-Module-Based Architecture for Beyond-NN Acceleration

Abstract: While neural networks (NNs) have achieved great results in various intelligent tasks like image classification and speech recognition, real-world scenarios have more applications beyond just ...