Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Green Watt Power’s Diamond Series of 2.4-kW AC chargers target e-mobility applications with 36-120-V Li-ion batteries.

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Bourns’ BVRA1210 and BVRA1812 multilayer varistors with advanced transient energy absorption deliver high surge protection.

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

Allegro’s CT4022/32 TMR current sensors claim ultra-low noise and high-precision current measurements for clean energy ...

TI launches a new automotive LiDAR laser driver, mmWave radar sensor, and BAW clocks, targeting improvements in vehicle ...

FLIR unveils starter kits for advanced multispectral imaging, delivering both thermal and visible imagery in one solution.

CML Micro’s single- and two-stage GaAs power amplifiers target a range of dual-cell lithium battery-powered wireless devices.

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

Omnivision’s OV50X 50-MP smartphone image sensor offers higher dynamic range for photos and video in the day and night.