Renesas Electronics introduces the RA0E2 MCUs with ultra-low power consumption and an extended temperature range.

At Auto Shanghai, Intel unveils its next-gen AI-enhanced SDV SoC, claiming the automotive industry’s first multi-node chiplet ...

Green Watt Power’s Diamond Series of 2.4-kW AC chargers target e-mobility applications with 36-120-V Li-ion batteries.

L-com expands its connector portfolio with rugged Bulgin circular connectors and other interconnects for harsh environments.

Bourns’ BVRA1210 and BVRA1812 multilayer varistors with advanced transient energy absorption deliver high surge protection.

Molex’s new report finds that advanced connector design is needed for constant connectivity in military, avionics, and ...

Allegro’s CT4022/32 TMR current sensors claim ultra-low noise and high-precision current measurements for clean energy ...

FLIR unveils starter kits for advanced multispectral imaging, delivering both thermal and visible imagery in one solution.

JEDEC announced the publication of the HBM4 DRAM standard, delivering higher bandwidth, efficiency, and capacity for AI and ...

GigaDevice’s GD5F1GM9 series addresses SPI NAND Flash’s inherently slow response times and vulnerability to bad block interference.

CML Micro’s single- and two-stage GaAs power amplifiers target a range of dual-cell lithium battery-powered wireless devices. CML Microcircuits has expanded its SµRF product portfolio with the ...