The US semiconductor company has commenced construction on a new high-bandwidth memory advanced packaging facility.

Micron Technology (NASDAQ:MU) announced a US$7 billion investment to build a high-bandwidth memory (HBM) chip-packaging facility in Singapore to meet rising global demand for artificial intelligence ...

The facility’s opening will bolster Micron’s technological edge and solidify SG’s position as a critical player in the global ...

Micron Technology Inc. is investing $7 billion over the next several years to expand its manufacturing footprint in Singapore, as artificial intelligence boosts demand for advanced memory chips.

Micron Technology, Inc. (NASDAQ:MU) broke ground on a new High-Bandwidth Memory (HBM) advanced packaging facility near the company’s current facilities in Singapore. It marks Singapore’s first HBM ...

Micron Technology is investing S$9.5 billion ($7 billion) to build an advanced chip packaging facility in Singapore as the semiconductor giant expands its capacity to cater to booming demand for ...

The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...

A US$7 billion Micron advanced packaging facility in Singapore will help manufacture high-bandwidth memory (HBM) chips in ...

Micron Technology is building a chip plant in Singapore, as part of an approximately $7 billion investment to meet artificial intelligence (AI) data center demand.The new HBM (high bandwidth ...

Micron Technology, Inc. has commenced the construction of a High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, the first of its kind in the country. The groundbreaking ceremony ...

Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore The newest ...

SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s ...