In addition to improved performance from individual sensing technologies, including radar and light detection and ranging ...

Unlike a flat membrane-type keypad, the rubber-bump keypad has a tactile, tangible feel when the key buttons are pressed; ...

While the market is booming, consumers want smaller, more integrated devices. MEMS (Micro-Electrical-Mechanical-Systems) ...

The rapidly increasing power demands of today’s complex AI models are already beginning to make continued AI growth a ...

The ACS37017 from Allegro MicroSystems is a Hall-effect current sensor designed for high-voltage power conversion systems in ...

Ironwood Electronics has released a new spring pin test socket for DFN2 packages. The socket is engineered to support up to ...

The EKO series from SCHURTER is a square-body high-voltage fuse family rated up to 1000 VDC and 1250 VAC for selected models, ...

The result is that the entire board is much denser, and comments can be installed on both sides of the PC board, as seen in Figure 2 . Since the board does not require drilling for component leads ...

This FAQ addresses the specific challenges this transition presents for assembly and how structural adhesives are emerging as an enabler for these complex systems.

Acromag has released a series of FPGA modules based on AMD Zynq UltraScale+™ MPSoC devices for embedded I/O processing and logic functions in industrial and real-time systems. These modules combine a ...

In essence, PAI is being used for data center optimization to support the demands of digital AI (DAI) applications like training large language models (LLMs), running inference for real-time ...