[Martin Thuo] at Iowa University used this property to make solder joints at room temperature using Field’s metal (a combination of bismuth, indium, and tin). The key is a process that coats the ...
Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, ...
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