Tessera this morning announced an alternative to ubiquitous ball-grid technology that could significantly change both chip-scale packaging and more complex assemblies such as package-in-package ...
SHENMAO America, Inc. is proud to announce the launch of its advanced solder paste, PF606-P275. This innovative lead-free, no-clean, zero- halogen solder paste is specifically designed for fine-pitch ...
Molded for lead-free process requirements, Multicore LF328 is a halide-free, no-clean, lead-free solder paste suitable for high-volume, stencil-printing applications with chip-scale-package lead ...
Indium Corporation will feature its Indium3.2HF solder paste at Semicon Taiwan 2018 from September 5-7. Indium Corporation's Indium3.2HF is a water-soluble, halogen-free, Pb-free solder paste. Indium3 ...
The adapter tops have landing pads that can be designed to accept any device on any pitch and easily settle into fine pitch footprints including Thin-Shrink Small Outline Packages (TSSOP) and Quad ...
CHUNAN, Taiwan--(BUSINESS WIRE)--TSLC Corporation, a vertically integrated LED system manufacturer, introduced the world’s first 0.49mm fine-pitch direct-lit display using 36 pixels-in-1 πLED package ...
Mill-Max Mfg. Corp. announces the availability of its new fine pitch SMT gull wing connector series. Mill-Max Mfg. Corp. announces the availability of its new fine pitch SMT gull wing connector series ...
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