Intel's new CEO Lip Bu-Tan took to the stage at the company's Intel Foundry Direct 2025 event here in San Jose, California, to outline the company's progress on its foundry initiative. Tan announced ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

YOKOHAMA, Japan, Aug. 27, 2025 /PRNewswire/ -- Socionext, the Solution SoC company, today announced the availability of 3DIC support in its portfolio of well-proven capabilities for the delivery of ...

Developers of high-end semiconductor products who face manufacturing limitations with respect to die sizes are investing in 3D stacked die technology. These advanced designs already push current ...

There's a rumored chip on the way from AMD with far more memory bandwidth than anything the company has shipped before. If the rumor is true, Milan-X will offer a mammoth amount of HBM bandwidth.

According to the latest report of Tom's Hardware on Wednesday, May 26, Patrick Schur and ExecutableFix tweeted that AMD is now getting a headstart on its preparation for the release of its new data ...

There's a rumored chip on the way from AMD with far more memory bandwidth than anything the company has shipped before. If the rumor is true, Milan-X will offer a mammoth amount of HBM bandwidth.